CLEAN-100 is a cleaning solution capable of removing particles and impurities of metal ions generated in the CU-CMP process.

It has an extremely low etching rate for various materials on the wafer surface and its liquid chemical composition complies with numerous workers’ safety and environmental regulations.

Chemical Name

Mixture of citric acid aqueous solution

CAS No.: 77-92-9
Molecular weight: n/a

Physical characteristics

Features High purity and high performance citric acid aqueous solution
One-step cleaning solution for metal impurities and particles


Main Applications

  • Post CMP cleaning solution
  • Post Cu-CMP cleaning solution
  • Post Cu/low-k cleaning solution


  • EINECS No: 201-069-1
  • REACH: n/a


Store in cool, well-ventilated, dry conditions in sealed containers.

Safety information


For specific information on the safe handling of the product, please refer to the material safety data sheet (MSDS) which is available on request.